The success of any electronic devices depends not only on the components used but how well they are attached to their contact pad. Given the precision with which the components must be attached, special machines have been designed to accomplish this delicate work. The machines that are never missing in any serious electronic assembly plants are the smt reflow ovens.
The ovens are intended to carry out reflow soldering; the system whereby some sticky paste of solder and flux is used to connect electrical parts to the contact cushions on a temporary basis awaiting permanent soldering. The next process is a step by step controlled heating that melts all the binds at their contact point with the mother board.
Thanks to this oven, surface mount (smt) components can be attached to the circuit board in a matter of minutes eliminating several labor hours that are necessary if other methods like individual joint soldering is used. The oven is specifically designed to be able to heat the surface melting the solder without damaging any of the electrical components. The typical reflow oven consists of four distinctive stages; preheat, the thermal soak, the reflow and the cooling zone.
In the preheat zone, the incline rate is secured. This is the rate of temperature rise per second. It is normally 1 to 3 degrees for every second. It should not surpass the most extreme incline as this can damage the parts or split the mother board. It can likewise prompt the scattering impact. The solvent in the mixture too begins to dissipate in the zone.
The thermal soak zone is the next step lasting for between sixty to one hundred and twenty seconds removing all the solder paste volatiles in the process. The flux segments also begin oxidation of the segment cushions and leads, a procedure known as flux initiation. The temperature must be correct, with low temperatures, flux fails to completely enact while high temperatures leads to spattering, balling or oxidation of the paste.
The reflow zone then takes over. In this zone, the highest possible temperature as determined by the component with the lowest temperature tolerance in the assembly is reached. The common peak is usually from 20 to 40 degree centigrade above liquidus.
Lastly, the cooling zone finishes the process. It is used to cool the processed board in a controlled manner solidifying all joints in the process. If done properly, it should prevent intermetallic formation and thermal shock. In order to achieve fine grains that are mechanically sound, faster cooling may be chosen.
The electronic assembly firms that are on the path of growth and profitability normally install new and the latest model machines. These are often associated with efficiency and reduced energy consumption. It is now possible to find the models of smt ovens that fit the description. The process of procuring one however must be done carefully. This involves understanding as much as possible about the manufacturers, the suppliers and the product itself.
The ovens are intended to carry out reflow soldering; the system whereby some sticky paste of solder and flux is used to connect electrical parts to the contact cushions on a temporary basis awaiting permanent soldering. The next process is a step by step controlled heating that melts all the binds at their contact point with the mother board.
Thanks to this oven, surface mount (smt) components can be attached to the circuit board in a matter of minutes eliminating several labor hours that are necessary if other methods like individual joint soldering is used. The oven is specifically designed to be able to heat the surface melting the solder without damaging any of the electrical components. The typical reflow oven consists of four distinctive stages; preheat, the thermal soak, the reflow and the cooling zone.
In the preheat zone, the incline rate is secured. This is the rate of temperature rise per second. It is normally 1 to 3 degrees for every second. It should not surpass the most extreme incline as this can damage the parts or split the mother board. It can likewise prompt the scattering impact. The solvent in the mixture too begins to dissipate in the zone.
The thermal soak zone is the next step lasting for between sixty to one hundred and twenty seconds removing all the solder paste volatiles in the process. The flux segments also begin oxidation of the segment cushions and leads, a procedure known as flux initiation. The temperature must be correct, with low temperatures, flux fails to completely enact while high temperatures leads to spattering, balling or oxidation of the paste.
The reflow zone then takes over. In this zone, the highest possible temperature as determined by the component with the lowest temperature tolerance in the assembly is reached. The common peak is usually from 20 to 40 degree centigrade above liquidus.
Lastly, the cooling zone finishes the process. It is used to cool the processed board in a controlled manner solidifying all joints in the process. If done properly, it should prevent intermetallic formation and thermal shock. In order to achieve fine grains that are mechanically sound, faster cooling may be chosen.
The electronic assembly firms that are on the path of growth and profitability normally install new and the latest model machines. These are often associated with efficiency and reduced energy consumption. It is now possible to find the models of smt ovens that fit the description. The process of procuring one however must be done carefully. This involves understanding as much as possible about the manufacturers, the suppliers and the product itself.
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